Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die package having mesh power and ground planes

Semiconductor die package having mesh power and ground planes

US Patent 6803650 · Granted Oct 12, 2004

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Miniature external temperature sensing device for estimating subsurface tissue t2023
Force sensor incorporated into display2020
Force determination employing sheet sensor2020
Temperature compensating sensor having a compliant layer separating independent 2019
Temperature compensating force sensor2019
Force determination employing sheet sensor and capacitive array2019
Force sensing based on capacitance changes2019
Force sensor incorporated into display2018
Force determination employing sheet sensor and capacitive array2018
Sensor layer having a patterned compliant layer2018
Temperature compensating transparent force sensor having a compliant layer2017
Display with semiconducting oxide and polysilicon transistors2017