Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

US Patent 6775140 · Granted Aug 10, 2004

Estimated economic value: $49,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming embedded wafer level chip scale packa2025
Semiconductor device and method of forming an optical semiconductor package with2025
Reliable semiconductor packages2025
Reliable semiconductor packages2024
Reliable semiconductor packages2024
Semiconductor device and method to minimize stress on stack via2024
Semiconductor device and method of making a wafer-level chip-scale package2024
Semiconductor packages with integrated shielding2024
Semiconductor package with dams2024
Semiconductor device and method of forming a 3D interposer system-in-package mod2023
EMI shielding for flip chip package with exposed die backside2023
Reliable semiconductor packages for sensor chips2023