Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections

Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections

US Patent 6770512 · Granted Aug 3, 2004

Estimated economic value: $1,898,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Contact liner in integrated circuit technology2010
Method and apparatus for packaging test integrated circuits2006
Method and system for locating chip-level defects through emission imaging of a 2006
Method and system for providing backside voltage contrast for silicon on insulat2006
Method and system for using emission microscopy in physical verification of memo2005
Detecting heat generating failures in unpassivated semiconductor devices2005
Method and apparatus for identifying individual die during failure analysis2004
Method and system for performing failure analysis on a multilayer silicon-on-ins2004
Method for revealing active regions in a SOI structure for DUT backside inspecti2004
Method for reducing stress-induced voids for 0.25 &mgr;m micron and smaller semi2003
Method and system for reducing polymer build up during plasma etch of an interme2003
Apparatus for holding and delayering a semiconductor die2002