Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025

Semiconductor-on-insulator (SOI) wafer having a Si/SiGe/Si active layer and method of fabrication using wafer bonding

US Patent 6765227 · Granted Jul 20, 2004

Estimated economic value: $1,607,000

Assignee

Inventors

View full patent text on Google Patents →