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Home › Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby

Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby

US Patent 6683373 · Granted Jan 27, 2004

Estimated economic value: $2,696,000 ⓘ

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