Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for controlling CMP pad surface finish

Method and apparatus for controlling CMP pad surface finish

US Patent 6645052 · Granted Nov 11, 2003

Estimated economic value: $12,334,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Alternating etch and passivation process2025
Alternating etch and passivation process2023
Alternating etch and passivation process2023
Dielectric contact etch2018
Hydrogen activated atomic layer etching2017
Pulsed dielectric etch process for in-situ metal hard mask shape control to enab2014
Method and system for uniformly applying a multi-phase cleaning solution to a su2014
Method and apparatus for cleaning a substrate using non-newtonian fluids2014
Method and system for uniformly applying a multi-phase cleaning solution to a su2013
Method and apparatus for cleaning semiconductor wafers using compressed and/or p2013
Method and apparatus for cleaning a substrate using non-Newtonian fluids2011
Method and apparatus for uniformly applying a multi-phase cleaning solution to a2011