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Home › Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed

Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed

US Patent 6630741 · Granted Oct 7, 2003

Estimated economic value: $3,893,000 ⓘ

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