Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for two-sided etch of a semiconductor substrate

Systems and methods for two-sided etch of a semiconductor substrate

US Patent 6624082 · Granted Sep 23, 2003

Estimated economic value: $10,382,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plasma sources and plasma processing apparatus thereof2025
Dual pressure oxidation method for forming an oxide layer in a feature2025
Uniformity control for plasma processing2025
Processing system and method of delivering a reactant gas2024
Asymmetric injection for better wafer uniformity2024
Gas supply member with baffle2024
Plasma processing with independent temperature control2023
Plasma sources and plasma processing apparatus thereof2023
Gas injector with baffle2022
Asymmetric injection for better wafer uniformity2022
Gas supply member with baffle2021
Gas injector with baffle2021