Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stable interfaces between electrically conductive adhesives and metals

Stable interfaces between electrically conductive adhesives and metals

US Patent 6613184 · Granted Sep 2, 2003

Estimated economic value: $11,479,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Intravaginal device2018
Apparatus and methods for multi-mode asynchronous communication2018
Coreless layer buildup structure with LGA and joining layer2016
Apparatus and methods for multi-mode asynchronous communication2015
Apparatus and methods for multi-mode asynchronous communication2014
Substrate having internal capacitor and method of making same2013
Electronic package with thermal interposer and method of making same2013
Coreless layer buildup structure2013
Coreless layer buildup structure with LGA2013
Method of forming an electrically conductive printed line2013
Method of forming multilayer capacitors in a printed circuit substrate2013
Electronic package including high density interposer and circuitized substrate a2013