Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fine pitch wafer bumping process

Fine pitch wafer bumping process

US Patent 6555296 · Granted Apr 29, 2003

Estimated economic value: $137,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Contrast edge barcodes2022
Methods and devices for cutting and abrading tissue2020
Methods and devices for cutting and abrading tissue2017
Electrical tooth brush2011
Semiconductor package without substrate and method of manufacturing same2004
Ball grid array semiconductor package and substrate without power ring or ground2003
Lead-frame-based chip-scale package and method of manufacturing the same2002
Quad flat non-lead package of semiconductor2002
Method of fabricating a ball grid array integrated circuit package having an enc2001
Multi-chip module package structure2001
Ball-grid array integrated circuit package with an embedded type of heat-dissipa2001
Multi-chip integrated circuit package structure for central pad chip2001