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Home › Tungsten CMP with improved alignment mark integrity, reduced edge residue, and reduced retainer ring notching

Tungsten CMP with improved alignment mark integrity, reduced edge residue, and reduced retainer ring notching

US Patent 6468136 · Granted Oct 22, 2002

Estimated economic value: $32,970,000 ⓘ

Assignee

Applied Materials

Inventors

Robert Lum (6 patents)
David W. Groechel (44 patents)
Li Wu (9 patents)
Chiu Chan (15 patents)

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