Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device

Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device

US Patent 6402849 · Granted Jun 11, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method of detecting horizontal synchronization signal in image for2014
Photo mask set for forming multi-layered interconnection lines and semiconductor2012
Multi-chamber system having compact installation set-up for an etching facility 2010
Photo mask set for forming multi-layered interconnection lines and semiconductor2007
Multi-chamber system having compact installation set-up for an etching facility 2005
Semiconductor wafer cleaning apparatus and method of using the same2004
Multi-chamber system having compact installation set-up for an etching facility 2003
Furnace of apparatus for manufacturing a semiconductor device having a heat bloc2002
Wafer dryer comprising revolving spray nozzle and method for drying wafers using2002
Method of manufacturing semiconductor devices, etching compositions for manufact2002
Diffusion system having air curtain formation function for manufacturing semicon2001
Wet-etching facility for manufacturing semiconductor devices2001