Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Partial underfill for flip-chip electronic packages

Partial underfill for flip-chip electronic packages

US Patent 6365441 · Granted Apr 2, 2002

Estimated economic value: $46,572,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Localized high density substrate routing2024
Localized high density substrate routing2024
Localized high density substrate routing2022
Localized high density substrate routing2020
Integrated circuit packages including high density bump-less build up layers and2018
Electronic assembly that includes stacked electronic devices2018
Flexible electronic assembly method2017
Localized high density substrate routing2016
Localized high density substrate routing2015
Process for assembling an integrated circuit package having a substrate vent hol2013
Microelectronic package containing silicon connecting region for high density in2013
Microelectronic package containing silicon patches for high density interconnect2011