Method of forming bumps on wafers or substrates

Assignee

• Orient Semiconductor Electronics, Limited

Inventors

• Wen-Lo Shieh (6 patents)
• Fu-Yu Huang (7 patents)
• Yung-Cheng Chuang (8 patents)
• Hsuan-Jui Chang (16 patents)
• Hui-Pin Chen (9 patents)
• Ning Huang (30 patents)
• Feng-Chang Tu (5 patents)
• Chung-Ming Chang (11 patents)
• Hua-Wen Chiang (7 patents)
• Chia-Chieh Hu (7 patents)

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