Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flexible substrate for packaging a semiconductor component

Flexible substrate for packaging a semiconductor component

US Patent 6300679 · Granted Oct 9, 2001

Estimated economic value: $3,817,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Curved semiconductor die systems and related methods2025
Semiconductor package electrical contact structures and related methods2025
Silicon-on-insulator die support structures and related methods2025
Semiconductor package electrical contacts and related methods2025
Semiconductor packages with die including cavities and related methods2025
Die sidewall coatings and related methods2025
Configurable low ohmic power circuits2025
Singulation systems and related methods2025
Backside metal patterning die singulation system and related methods2025
Substrate alignment systems and related methods2025
Backside metal patterning die singulation systems and related methods2025
Non-planar semiconductor packaging systems and related methods2025