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Home › Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue

Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue

US Patent 6291331 · Granted Sep 18, 2001

Estimated economic value: $3,498,000 ⓘ

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