Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer thinning apparatus having feedback control

Wafer thinning apparatus having feedback control

US Patent 11728172 · Granted Aug 15, 2023

Estimated economic value: $5,717,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical-mechanical planarization pad and methods of use2025
CMP system and method of use2025
Composition and method for polishing and integrated circuit2025
Bevel edge removal methods, tools, and systems2025
Chemical mechanical polishing apparatus and method2025
Chemical mechanical polish slurry and method of manufacture2025
Temperature control in chemical mechanical polish2025
Slurry composition and method for polishing and integrated circuit2025
Chemical mechanical polishing method2025
System and method for removing impurities during chemical mechanical planarizati2025
Semiconductor device structure with an interconnect structure in a dielectric la2025
Hotspot avoidance method of manufacturing integrated circuits2025