Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate with die area having same CTE as IC

Substrate with die area having same CTE as IC

US Patent 6248959 · Granted Jun 19, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for a collaborative interaction network2009
Interconnect module with reduced power distribution impedance2005
Dimensionally stable core for use in high density chip packages and a method of 2002
Method for minimizing warp in the production of electronic assemblies2001
Constraining ring for use in electronic packaging2001
Method of increasing package reliability by designing in plane CTE gradients2000
Method for minimizing warp and die stress in the production of an electronic ass2000
Method for assembling an integrated circuit chip package having an underfill mat2000
Chip package mounting structure for controlling warp of electronic assemblies du2000
Constraining ring for use in electronic packaging2000
Method of making a lid for a chip/package system1999
Method for assembling an integrated circuit chip package having at least one sem1999