Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin

Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin

US Patent 6242287 · Granted Jun 5, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of forming leads of a semiconductor device2006
Mold for resin-sealing of semiconductor devices2003
Semiconductor manufacturing apparatus and method of manufacturing semiconductor 2002
Press machine and method of manufacturing pressed products2002
Apparatus for and method of fabricating semiconductor devices1998
Method and apparatus for carrying and locating sheet frame1997
Press control method and press apparatus1996
Method and apparatus for carrying and locating sheet frame1996
Plasma processing apparatus and plasma cleaning method1993
Process for plasma etching1993
Device for feeding thin-web frame1993
Semiconductor device having soldered bond between base and cap thereof1986