Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of planarizing a structure having an interpoly layer

Method of planarizing a structure having an interpoly layer

US Patent 6143664 · Granted Nov 7, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Foldable trolley case2025
Semiconductor structure having a silicon active layer formed over a SiGe etch st2025
Apparatus and method for wafer bonding2025
Dual etch-stop layer structure2025
Fabric with electrical components2025
Interconnection structure and methods of forming the same2025
Semiconductor-on-insulator wafer having a composite insulator layer2025
Method of fabricating semiconductor device with reduced trench distortions2025
Structure for embedded gettering in a silicon on insulator wafer2025
Electronic devices with edge illuminators2025
Method and structure of cut end with self-aligned double patterning2025
Self-assembled dielectric on metal rie lines to increase reliability2025