Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated CVD/PVD Al planarization using ultra-thin nucleation layers

Integrated CVD/PVD Al planarization using ultra-thin nucleation layers

US Patent 6139905 · Granted Oct 31, 2000

Estimated economic value: $72,215,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and process with assisted gas flow inside a reaction chamber2025
Coal rock three-dimensional strain field visual system and method under mining i2025
Battery module2025
Monolithic complementary field-effect transistors having carbon-doped release la2025
System with power jet modules and method thereof2025
Perovskite/silicon heterojunction tandem solar cell and preparation method there2025
Automatic scanning system for tunnel walls constructed by open-type TBM2025
Processing system and method for producing a particulate material2024
Material pushing apparatus and charging method thereof, and material pushing mac2024
Materials and methods of producing lithium cobalt oxide materials of a battery c2024
Method for manufacturing double-layer fair mugs2024
Method for quickly optimizing key mining parameters of outburst coal seam2024