Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses

Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses

US Patent 6043559 · Granted Mar 28, 2000

Estimated economic value: $241,499,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Configurable resistivity for lines in a memory device2024
Electrostatic charge measurement tool2024
Modified write voltage for memory devices2023
Configurable resistivity for lines in a memory device2022
Modified write voltage for memory devices2021
Non volatile cross point memory having word line pass transistor with multiple a2021
Set technique for phase change memory2021
Tailoring current magnitude and duration during a programming pulse for a memory2020
Tailoring timing offsets during a programming pulse for a memory device2020
Tailoring current magnitude and duration during a programming pulse for a memory2019
Set technique for phase change memory2019
Heat spreader and stiffener having a stiffener extension2006