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Home › Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure

Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure

US Patent 6015749 · Granted Jan 18, 2000

Estimated economic value: $3,508,000 ⓘ

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