Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Grid array device package including advanced heat transfer mechanisms

Grid array device package including advanced heat transfer mechanisms

US Patent 6008536 · Granted Dec 28, 1999

Estimated economic value: $21,471,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermal improvement of integrated circuit packages2015
Preferentially cooled electronic device2010
Optimized bond out method for flip chip wafers2006
Multi-level redistribution layer traces for reducing current crowding in flipchi2004
Thermally-enhanced flip chip IC package with extruded heatspreader2000
Fixture for lid-attachment for encapsulated packages2000
Stiffener ring attachment with holes and removable snap-in heat sink or heat spr2000
Stiffener with slots for clip-on heat sink attachment1999
Stiffener with integrated heat sink attachment1999
High performance heat spreader for flip chip packages1999
Conformal diamond coating for thermal improvement of electronic packages1999
Apparatus and method for clip-on attachment of heat sinks to encapsulated semico1999