Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally-enhanced flip chip IC package with extruded heatspreader

Thermally-enhanced flip chip IC package with extruded heatspreader

US Patent 6114761 · Granted Sep 5, 2000

Estimated economic value: $14,742,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carrier boat for die package flux cleaning2025
Semiconductor chip having stepped conductive pillars2025
Regulator circuit package techniques2024
Semiconductor chip having stepped conductive pillars2024
Three-dimensional packaging techniques for power FET density improvement2022
Electronic module for high power applications2022
Integrated circuit product customizations for identification code visibility2022
Package with overhang inductor2022
Regulator circuit package techniques2021
Multi-RDL structure packages and methods of fabricating the same2021
Multi-RDL structure packages and methods of fabricating the same2020
Thermal improvement of integrated circuit packages2015