Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages

Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages

US Patent 5898571 · Granted Apr 27, 1999

Estimated economic value: $7,915,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermal improvement of integrated circuit packages2015
Preferentially cooled electronic device2010
Optimized bond out method for flip chip wafers2006
Multi-level redistribution layer traces for reducing current crowding in flipchi2004
Thermally-enhanced flip chip IC package with extruded heatspreader2000
Fixture for lid-attachment for encapsulated packages2000
Stiffener ring attachment with holes and removable snap-in heat sink or heat spr2000
Grid array device package including advanced heat transfer mechanisms1999
Stiffener with slots for clip-on heat sink attachment1999
Stiffener with integrated heat sink attachment1999
High performance heat spreader for flip chip packages1999
Conformal diamond coating for thermal improvement of electronic packages1999