Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making a molded flex circuit ball grid array

Method of making a molded flex circuit ball grid array

US Patent 5985695 · Granted Nov 16, 1999

Estimated economic value: $55,152,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods related to dual-sided module with land-grid array (LGA) footprint2025
Fine pitch copper pillar package and method2025
Packaged module with ball grid array and grounding pins for signal isolation, me2024
Stackable package and method2024
Reduction of packaging substrate deformation2024
Devices and methods related to dual-sided radio-frequency package with overmold 2024
Devices related to dual-sided module with land-grid array (LGA) footprint2024
Devices and methods related to nested filters2023
Methods and devices related to reduced packaging substrate deformation2023
Packaging for fingerprint sensors and methods of manufacture2023
Methods and structures for increasing the allowable die size in TMV packages2022
Control of under-fill using a film during fabrication for a dual-sided ball grid2022