Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging for fingerprint sensors and methods of manufacture

Packaging for fingerprint sensors and methods of manufacture

US Patent 11545405 · Granted Jan 3, 2023

Estimated economic value: $29,846,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor module2025
Photonic glass layer substrate with embedded optical structures for communicatin2025
Electrochemical device2025
Method for collective dishing of singulated dies2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Fingerprint sensor and button combinations and methods of making same2025
Methods related to dual-sided module with land-grid array (LGA) footprint2025
Health monitor device with sensors2025
Methods for fabrication of optical structures on photonic glass layer substrates2025
Fluid sensor module2025
Fine pitch copper pillar package and method2025
Semiconductor device with tiered pillar and manufacturing method thereof2024