{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for in-situ environment sensitive sealing and/or product controlling", "item": "https://www.patentleaderboard.com/patent/5911945"}]}
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Home › Method for in-situ environment sensitive sealing and/or product controlling

Method for in-situ environment sensitive sealing and/or product controlling

US Patent 5911945 · Granted Jun 15, 1999

Estimated economic value: $42,603,000 ⓘ

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