Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › PIC die packaging using magnetics to position optical element

PIC die packaging using magnetics to position optical element

US Patent 10409014 · Granted Sep 10, 2019

Estimated economic value: $36,532,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Edge couplers with a fine-alignment mechanism2025
Waveguide cores with a dual-trapezoidal shape2024
Photonics chips including cavities with non-right-angle internal corners2023
Pic structure having barrier surrounding opening for optical element to prevent 2023
Integrated circuit structure with optical absorber layer over optical grating co2022
Multi-layered substrates of semiconductor devices2022
Multi-layered substrates of semiconductor devices2022
Microelectronics package with ultra-low-K dielectric region between stacked ante2022
Microelectronics package with ultra-low-K dielectric region between stacked ante2022
Integrated circuit structure with optical absorber layer over optical grating co2021
Pluggable LGA socket for high density interconnects2021
Microelectronics package with ultra-low-K dielectric region between stacked ante2021