Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processing

Method for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processing

US Patent 5870187 · Granted Feb 9, 1999

Estimated economic value: $105,990,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Iterative liquid aspiration2025
Pipette tip extension, pipette tip, assembly of pipette tip and pipette tip exte2025
3D-printed mask for lysing at a location on a tissue section2025
Systems and methods for analyzing defects in CVD films2025
Method of treating a sample2025
Cartridge, electrowetting sample processing system and bead manipulation method2024
Pipette tip extension for treating a sample with a liquid attachable to a pipett2024
Cartridge and electrowetting sample processing system with delivery zone2024
Cartridge, electrowetting sample processing system and droplet formation2024
Systems and methods for analyzing defects in CVD films2023
Cartridge, electrowetting sample processing system and bead manipulation method2023
Fast-indexing filter wheel and method of use2015