{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "High temperature electromigration stress test system, test socket, and use thereof", "item": "https://www.patentleaderboard.com/patent/5760595"}]}

Home › High temperature electromigration stress test system, test socket, and use thereof

High temperature electromigration stress test system, test socket, and use thereof

US Patent 5760595 · Granted Jun 2, 1998

Estimated economic value: $5,806,000 ⓘ

Assignee

IBM

Inventors

Robert D. Edwards (11 patents)
Unknown
James J. Poulin (2 patents)
Hazara S. Rathore (33 patents)
Richard G. Smith (23 patents)

View full patent text on Google Patents →