Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer substrate structure

Multi-layer substrate structure

US Patent 5689091 · Granted Nov 18, 1997

Estimated economic value: $6,250,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-efficiency solar photovoltaic cells and modules using thin crystalline semi2017
Method of fabricating a BGA package using PCB and tape in a die-up configuration2002
Reinforced sealing technique for an integrated circuit package2001
High density leaded ball-grid array package2001
SiO2 wire bond insulation in semiconductor assemblies2001
Molded lead frame ball grid array2000
BGA package using PCB and tape in a die-up configuration2000
Printed circuit board layout to minimize the clock delay caused by mismatch in l2000
Oxide wire bond insulation in semiconductor assemblies2000
Oxide wire bond insulation in semiconductor assemblies2000
S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies2000
BGA package using PCB and tape in a die-down configuration1999