Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842949 | High-efficiency solar photovoltaic cells and modules using thin crystalline semiconductor absorbers | Mehrdad M. Moslehi, Pawan Kapur, K.-Josef Kramer, Virendra V. Rana, Sean M. Seutter +8 more | 2017-12-12 |
| 6228683 | High density leaded ball-grid array package | — | 2001-05-08 |
| 6177726 | SiO2 wire bond insulation in semiconductor assemblies | — | 2001-01-23 |
| 6083776 | Molded lead frame ball grid array | — | 2000-07-04 |
| 6046075 | Oxide wire bond insulation in semiconductor assemblies | — | 2000-04-04 |
| 6040633 | Oxide wire bond insulation in semiconductor assemblies | — | 2000-03-21 |
| 6033937 | S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies | — | 2000-03-07 |
| 5863812 | Process for manufacturing a multi layer bumped semiconductor device | — | 1999-01-26 |
| 5854512 | High density leaded ball-grid array package | — | 1998-12-29 |
| 5847455 | Molded leadframe ball grid array | — | 1998-12-08 |
| 5800958 | Electrically enhanced power quad flat pack arrangement | — | 1998-09-01 |
| 5796038 | Technique to produce cavity-up HBGA packages | — | 1998-08-18 |
| 5710695 | Leadframe ball grid array package | — | 1998-01-20 |
| 5689091 | Multi-layer substrate structure | Ahmad Hamzehdoost | 1997-11-18 |
| 5661337 | Technique for improving bonding strength of leadframe to substrate in semiconductor IC chip packages | — | 1997-08-26 |
| 5646831 | Electrically enhanced power quad flat pack arrangement | — | 1997-07-08 |