Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming wiring with gaps in bend to improve electromigration resistance

Method of forming wiring with gaps in bend to improve electromigration resistance

US Patent 5633198 · Granted May 27, 1997

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Image processing method and system2011
High density plasma chemical vapor deposition process2011
High density plasma chemical vapor deposition process2010
High density plasma chemical vapor deposition process2009
Air gap for dual damascene applications2008
Dual damascene structure for the wiring-line structures of multi-level interconn2008
High density plasma chemical vapor deposition process2007
Air gap formation method for reducing undesired capacitive coupling between inte2007
Air gap for tungsten/aluminum plug applications2006
Method of forming a semi-insulating region2006
High density plasma chemical vapor deposition process2006
Method of forming a semi-insulating region2006