Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for simulating and optimizing a chemical mechanical polishing system

Apparatus and method for simulating and optimizing a chemical mechanical polishing system

US Patent 5599423 · Granted Feb 4, 1997

Estimated economic value: $35,378,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Eddy current monitoring to detect vibration in polishing2025
Polishing apparatus using machine learning and compensation for pad thickness2025
Technique for training neural network for use in in-situ monitoring during polis2024
Trained neural network in in-situ monitoring during polishing and polishing syst2024
Profile control with multiple instances of contol algorithm during polishing2024
Switching control algorithms on detection of exposure of underlying layer during2023
Technique for training neural network for use in in-situ monitoring during polis2023
Compensation for substrate doping for in-situ electromagnetic inductive monitori2023
Small batch polishing fluid delivery for CMP2023
Color imaging for CMP monitoring2023
Using a trained neural network for use in in-situ monitoring during polishing an2023
Polishing apparatus using machine learning and compensation for pad thickness2022