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Home › An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame

An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame

US Patent 5444602 · Granted Aug 22, 1995

Estimated economic value: $61,449,000 ⓘ

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