Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Technique for enhancing adhesion capability of heat spreaders in molded packages

Technique for enhancing adhesion capability of heat spreaders in molded packages

US Patent 5362680 · Granted Nov 8, 1994

Estimated economic value: $12,136,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Tape supported memory card leadframe structure2009
Refractory metal substrate with improved thermal conductivity2008
Memory card ESC substrate insert2007
Wafer-scale assembly of chip-size packages2004
Ball grid assembly with solder columns2003
Wafer-scale assembly of chip-size packages2002
Ball grid assembly with solder columns2001
System for positioning a carrier relative to a travel path2001
System for applying a rotary force to strips of varying widths2001
Radiant chamber for simultaneous rapid die attach and lead frame embed for ceram2001
Stress relief matrix for integrated circuit packaging2000
Automated multiple lead frame strip radiant die attach material curing apparatus2000