Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etching processes for avoiding edge stress in semiconductor chip solder bumps

Etching processes for avoiding edge stress in semiconductor chip solder bumps

US Patent 5268072 · Granted Dec 7, 1993

Estimated economic value: $8,444,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photocatalytic fluid purification systems2024
Monolithic composite photocatalysts2024
Antimicrobial surface systems2024
Combined VOC mitigating and antimicrobial systems2024
Photocatalytic fluidized bed reactor systems2024
Monolithic composite photocatalysts2022
Micro-electro-mechanical system (MEMS) structures and design structures2021
Use of a reactive, or reducing gas as a method to increase contact lifetime in m2021
Planar cavity MEMS and related structures, methods of manufacture and design str2021
Planar cavity MEMS and related structures, methods of manufacture and design str2021
Photocatalytic surface systems2021
Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of ma2020