Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of taper-etching with photoresist adhesion layer

Method of taper-etching with photoresist adhesion layer

US Patent 5057186 · Granted Oct 15, 1991

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

In-situ removal of surface impurities prior to arsenic-doped polysilicon deposit2009
Structure and method for improved heat conduction for semiconductor devices2009
Structure and method for improved heat conduction for semiconductor devices2008
Test structure and method for yield improvement of double poly bipolar device2006
Vertical replacement gate (VRG) MOSFET with a conductive layer adjacent a source2003
Method of planarizing a surface on an integrated circuit2001
Electronic apparatus having improved scratch and mechanical resistance2001
Mechanism for bow reduction and critical dimension control in etching silicon di2001
High density plasma passivation layer and method of application2000
Integrated circuit dielectric formation2000
Plasma reactor with enhanced plasma uniformity by gas addition, reduced chamber 2000
Reduced size etching method for integrated circuits1999