Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent

Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent

US Patent 5053280 · Granted Oct 1, 1991

Estimated economic value: $54,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Prepreg, laminate, and production methods therefor, as well as printed circuit b2025
Temperature control apparatus2024
System for reconstructing and outputting a structure of an estimation sample usi2024
Prepreg for coreless substrate, coreless substrate and semiconductor package2023
Interlayer insulating film and method for producing same2022
Modified silicone compound, and thermosetting resin composition, prepreg, lamina2022
Support-provided insulating layer, laminate, and wiring board2022
Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing2020
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit2019
Siloxane compound, modified imide resin, thermosetting resin composition, prepre2019
Structure for seismic isolation, steel support structure, and method for seismic2019
Fluorescence microscopy apparatus2019