Sealing and stress relief layers and use thereof

Assignee

• IBM

Inventors

• David W. Boss (2 patents)
• Timothy Carr (8 patents)
• Derry J. Dubetsky (4 patents)
• George M. Greenstein (1 patents)
• Warren D. Grobman (11 patents)
• Carl P. Hayunga (3 patents)
• Amanda H. Kumar (1 patents)
• Walter F. Lange (3 patents)
• Robert H. Massey (1 patents)
• Paul H. Palmateer (7 patents)
• John A. Romano (1 patents)
• Da-Yuan Shih (119 patents)

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