Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for fabricating dielectrically isolated devices utilizing heating of the polycrystalline support layer to prevent substrate deformation

Process for fabricating dielectrically isolated devices utilizing heating of the polycrystalline support layer to prevent substrate deformation

US Patent 4581814 · Granted Apr 15, 1986

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Customized polishing pads for CMP and methods of fabrication and use thereof2019
Thin epitaxial silicon carbide wafer fabrication2017
Customized polishing pads for CMP and methods of fabrication and use thereof2016
Methods for producing in-situ grooves in chemical mechanical planarization (CMP)2015
Customized polishing pads for CMP and methods of fabrication and use thereof2014
Customized polishing pads for CMP and methods of fabrication and use thereof2014
Customized polish pads for chemical mechanical planarization2013
Substrates for monolithic optical circuits and electronic circuits2012
Methods for producing in-situ grooves in chemical mechanical planarization (CMP)2012
Oxidation after oxide dissolution2012
Multi-piece food product and method for making the same2011
Relaxation of a strained layer using a molten layer2011