Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs

Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs

US Patent 8932116 · Granted Jan 13, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Customized polishing pads for CMP and methods of fabrication and use thereof2019
Customized polishing pads for CMP and methods of fabrication and use thereof2019
Customized polishing pads for CMP and methods of fabrication and use thereof2016
Customized polishing pads for CMP and methods of fabrication and use thereof2016
Customized polishing pads for CMP and methods of fabrication and use thereof2014
Customized polishing pads for CMP and methods of fabrication and use thereof2014
Customized polishing pads for CMP and methods of fabrication and use thereof2014
Customized polishing pads for CMP and methods of fabrication and use thereof2014
Customized polish pads for chemical mechanical planarization2013
Methods for producing in-situ grooves in chemical mechanical planarization (CMP)2012
Methods for producing in-situ grooves in chemical mechanical planarization (CMP)2012
Methods for producing in-situ grooves in chemical mechanical planarization (CMP)2012