Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for patterning films using reactive ion etching thereof

Method for patterning films using reactive ion etching thereof

US Patent 4343677 · Granted Aug 10, 1982

Estimated economic value: $9,952,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stand-off pad for supporting a wafer on a substrate support chuck2001
Oxide etch process with high selectivity to nitride suitable for use on surfaces2001
Method for forming titanium silicide in situ2000
Puncture resistant electrostatic chuck1999
Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separati1999
Method of making electrostatic chuck with conformal insulator film1998
Electrostatic chuck with conformal insulator film1998
Puncture resistant electrostatic chuck1998
Self-cleaning polymer-free top electrode for parallel electrode etch operation1996
Method of determining a dechucking voltage which nullifies a residual electrosta1996
Method for planarization of submicron vias and the manufacture of semiconductor 1994
Multiple insulating layer for two-level interconnected metallization in semicond1991