Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same

Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same

US Patent 12456699 · Granted Oct 28, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional memory device including composite backside metal fill structur2025
High aspect ratio via fill process employing selective metal deposition and stru2025
Bonded assembly including interconnect-level bonding pads and methods of forming2025
Bonded assembly including interconnect-level bonding pads and methods of forming2025
Bonded assembly including interconnect-level bonding pads and methods of forming2025
Three-dimensional memory device including composite backside metal fill structur2025
High aspect ratio via fill process employing selective metal deposition and stru2024
High aspect ratio via fill process employing selective metal deposition and stru2024
High aspect ratio via fill process employing selective metal deposition and stru2024
Three-dimensional memory device including aluminum alloy word lines and method o2024
Three-dimensional memory device containing self-aligned bit line contacts and me2024
Three-dimensional memory device containing self-aligned bit line contacts and me2024