Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package structure with redistribution layer having bonding portion

Chip package structure with redistribution layer having bonding portion

US Patent 12438120 · Granted Oct 7, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package, package structure and method of manufacturing the same2025
Semiconductor device and methods of manufacture2025
Photonic semiconductor-insulator-semiconductor modulator and methods for forming2025
Multi-die package structures including redistribution layers2025
Method of singulating a semiconductor device2025
Package with heat dissipation structure and method for forming the same2025
Package with heat dissipation structure and method for forming the same2025
Multi-die package structures including an interconnected package component dispo2025
Semiconductor package and manufacturing method thereof2025
Chip package structure with conductive shielding film2025
Packages with stacked dies and methods of forming the same2025
Stacked image sensor device and method of forming same2025