Structure and formation method of semiconductor device with contact structures

Assignee

• TSMC

Inventors

• Shih-Chieh Wu (12 patents)
• Pang-Chi Wu (11 patents)
• Wang-Jung Hsueh (11 patents)
• Chao-Hsun Wang (59 patents)
• Kuo-Yi Chao (58 patents)
• Mei-Yun Wang (205 patents)
• Yi-Chun Chang (20 patents)
• Yuan-Tien Tu (27 patents)

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