Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multilayer dielectric stack for damascene top-via integration

Multilayer dielectric stack for damascene top-via integration

US Patent 12334398 · Granted Jun 17, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked vertical transport field effect transistor with anchors2025
Double patterned microcooler having alternating fin widths2025
Double patterned microcooler having alternating fin widths2025
Double patterned microcooler having alternating fin widths2025
Double patterned microcooler having alternating fin widths2025
Stacked FETS with contact placeholder structures2025
Forksheet transistor with dual depth late cell boundary cut2025
Light sensor and a method for manufacturing a light sensor2025
Patterning magnetic tunnel junctions and the like while reducing detrimental res2025
Via to backside power rail through active region2025
Via to backside power rail through active region2025
Skip-level TSV with hybrid dielectric scheme for backside power delivery2025