Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

Assignee

• Sekisui Chemical Co.

Inventors

• Sayaka Wakioka (7 patents)
• Yuta Oatari (3 patents)
• Kohei Takeda (27 patents)
• Masami Shindo (6 patents)
• Takashi Shinjo (11 patents)
• Yuko Kawahara (8 patents)
• Susumu Baba (22 patents)
• Tatsushi Hayashi (13 patents)

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